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Conference Program Preview 2008

The conference session will cover the following fields:

  • Lead-free Soldering and RoHS-conform technologies
  • Semiconductor Packaging & Power Electronics
  • PCB Technologies, Surface Finishes and Quality
  • Reliability and Testing
  • Assembling and Soldering Technologies
  • Electronic Markets and Future Trends

Last Conference Program Review 2007

TUTORIALS
Tutorial: Sino-European RoHS-Dialogue

Speaker:
Dr. Jutta Müller
(Fraunhofer Institute for Reliability and Microintegration)
Mr. Luo Daojun
(Ministry for the Information Industry,
No. 5 Electronic Institute, China Cyber Laboratory)
Mr. Hans-Juergen Lueckefett
(1WEEE Services GmbH)

 

CONFERENCE SESSIONS
THURSDAY – MARCH 22, 2007
08:30-09:00
 Morning Coffee & Tea
09:00-09:30
 Inaugural Address
Session 1: “Lead-free” Implementation
09:30-11:45
 Chair:
Prof. Li Ming
(Shanghai Jiaotong University)
Co-Chair:
Dr. Jutta Müller
(Fraunhofer Institute for Reliability and Microintegration)
09:30-10:15
 Key Note Speech
"Sucessful Lead-Free Implementation: Pre-Conditions and Status
Prof. Hans-Jürgen Albrecht
Siemens AG (Berlin, Germany)
10:15-10:45
 ”Properties and Soldering Behaviour of Eutectic SnZn Solder Alloy”
Prof. Jürgen Villain
FH Augsburg, Material Science & Manufacturing / Electrical Engineering
(Augsburg, Germany)
10:45-11:15
 ”Conducive Adhesive as a Lead Free Solution”
Mr. Alexander Brand
W. C. Heraeus GmBH & Co. KG, Contact Materials Division (Hanau, Germany)
11:15-11:45
 ”Lead Free Soldering and Selective Wave Soldering Technology”
Mr. David Chen
ERSA Asia Pacific (Shanghai, PR China)
11:45-13:00
 Lunch
Session 2: Advanced Circuit Assembling
13:00-15:55
 Chair:
Jin Cunzhong
(China Electronic Equipment Industry Association)
Co-Chair:
Prof. Thomas Gessner
(University of Chemnitz)
13:00-13:45
 Key Note Speech
”Electronics Product Miniaturization and Impact on the Supply Chain”
Mr. Dongkai Shangguan, Ph.D
Flextronics, Advanced Process Technology (San Jose, U.S.A.)
13:45-14:15
 ”Low-Cost High-Speed Assembly of Thin/Lightweight Components Including Bare Die”
Mr. Colin Koh
Tempo Electronics (North Hollywood, USA)
14:15-14:45
 ”01005 Capability - The 01005 Process Within the Entire Production System”
Mr. Wang Qiongan
Siemens Electronics Assembly Systems Ltd. (Shanghai, China)
14:45-15:15
 ”Void Free Soldering with Vacuum”
Mr. Klaus Roemer
PINK GmbH, Vacuum Technology (Wertheim, Germany)
15:15-15:45
 Afternoon Coffee & Tea
Session 3: New Printed Circuit Board Technologies
15:45-17:30
 Chair:
Shangguan Dongkai
(Flextronics Corporate Technology Group)
Co-Chair:
Prof. Mathias Nowottnick
(University of Rostock)
15:45-16:30
 Key Note Speech
”High Density, Miniaturization, Integration - Challenge and Opportunity for Future PWBs”
Dr. Hannes Voraberger
AT&S AG (Leoben, Austria)
16:30-17:00
 ”Electroless Nickel/Gold – Practical Aspects of „Black Pad“-free and High Sophisticated Lead Free Surfaces for Solder-and Wire Bonding Applications”
Mr. Bernd Endres
Gramm-Oberflächentechnik GmbH (Ditzingen-Heimerdingen, Germany)
17:00-17:30
 ”Printed Circuit Boards in Microfluidic Applications”
Stefan Gassmann
University of Rostock (Rostock, Germany)

 

CONFERENCE SESSIONS
FRIDAY – MARCH 23, 2007
08:30-09:00
 Morning Coffee & Tea
Session 4: Development in Packaging
09:00-11:45
 Chair:
Prof. Wang Xingqian
(Shanghai Electronic Components Trade Association)
Co-Chair:
Rolf Aschenbrenner
(Fraunhofer Institute for Reliability and Microintegration)
09:00-09:45
 Key Note Speech
"Micromechanical Sensor for Automotive and Consumer Electronics Applications"
Hubertus von Janecek
Bosch Sensortec (Reutlingen, Germany)
09:45-10:15
 Invited Speaker
“Feasibility Study on Board Assembly of SMD with NiPdAu Finished Lead Frame”
Dr. Susan Xinjuan Zhao
Philips Applied Technologies - Asia Pacific (Singapore)
10:15-10:45
 “Statistical Evaluation for Type-6 pb-Free Solder Paste Printing Down to 200-Microns Pitch”
Mr. Thomas Krebs
W. C. Heraeus GmBH & Co. KG, Contact Materials Division (Hanau, Germany)
10:45-11:15
 ”Flat Bump Package”
Ms. Vivian Tao
Advanced Packaging Co. Ltd. (China)
11:15-11:45
 ”Industrial Wafer Ball Attach by Gravity Feeding in Comparison to Competing Technologies”
Mr. Wolfgang Reinert
Fraunhofer Institute for Silicon Technology (Itzehoe, Germany)
11:45-13:00
 Lunch
Session 5: Solutions for Reliable Assemblies
13:00-15:15
 Chair:
Prof. Hans-Jürgen Albrecht (Siemens AG)
Co-Chair:
Prof. Bernd Michel (Fraunhofer Institute for Reliability and Microintegration)
13:00-13:45
 Invited Speaker
“Experimental Testing and Reliability Analysis of Electronic Packaging Materials”
Dr. Hans Walter
Fraunhofer Institute for Reliability and Microintegration (Berlin, Germany)
13:45-14:15
 “Novel SACX Solders with Drop Test Performance Outperforming Eutectic Tin-Lead”
Dr. Ning-Cheng Lee
Indium Corporation of America (Clinton, U.S.A.)
14:15-14:45
 ”Critical Design Factors Analysis to the Reliability of High Aspect Ratio PTH”
Mr. Zhang Yuan
Huawei Technologies Co.,LTD (Shenzhen, PR China)
14:45-15:15
 ”Conformal Coatings and their Increasing Importance for a Safe Operation of Electronic Assemblies”
Mr. Peter Li
Lackwerke Peters GmbH + Co KG (Kempen, Germany)
15:15-15:45
 ”The Challange of Traceability: Necessary Evil or Competitive Advantage?”
Mr. Liu Hua
Kratzer Automation (Unterschleissheim, Germany)
15:45-16:15
 Afternoon Coffee & Tea
Session 6: Electronic Markets & Future Trends
16:15-18:00
 Chair:
Mr. Sun Feng
(China Communication Industry Association)
Co-Chair:
Mr. Anton Z. Miric
(W. C. Heraeus GmbH & Co. KG)
16:15-17:00
 Key Note Speech
"The Development of PCB for the Next Decade"
Prof. Wolfgang Scheel
Fraunhofer Institute for Reliability and Microintegration (Berlin, Germany)
17:00-17:30
 Invited Speaker
“Highlights of the 2007 iNEMI Raodmap”
Dr. Robert C. Pfahl
International Electronics Manufacturing Initiative, Inc. (iNEMI)
17:30-18:00
 ”Market Analyses of Placement Machines in China”
Mr. Zhong Binggang
China Electronic Production Equipment Industry Association

A detailed program can be downloaded here.