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Exhibitor's Profile

Nature of Business:

Manufacturing Equipment (Packaging/Assembly/SMT equipments)
Semiconductor – Back End Packaging
PCB Assembly (OEM/ODM/EMS)
Components, Modules and Devices
Materials, Substrates and Chemicals
Test & Quality Assurance Components and Systems
IC Design
Service Companies
R&D
Publications
Consulting
Group of Products:

Assembly Equipment

  • Pick & Place
  • Printers
  • Reflow
  • Cleaning
  • Handling
  • Repair
  • Testing (AOI, X-ray)
  • Other Assembly Equipment

Packaging Equipment

  • Molding/Encapsulation
  • Backgrinding/Lapping
  • Solder Bumping Systems
  • Dicing/Separation Equipment
  • Die Coating Equipment/Dispensing Systems
  • Electroplating/ Lead Finishing/Straightening Equipment
  • Die attaching/Wirebonders
  • Heating/Curing Equipment
  • Cleaning
  • Marking/Leballing
  • Testing and Analysis System
  • Other Packaging Equipment

Electronic modules, assemblies, components and devices

Materials and tools
Soldering Materials

  • Adhesives
  • Coatings
  • Underfills
  • Encapsulants
  • Molding Compounds
  • Cleaning Materials
  • Stencils
  • Others

Antistatic Equipment

Design Systems (EADS)

Software

Services

Publications

Others