The exhibition will give an overview of today’s electronic packaging & assembly equipments and systems on the highest level.
Due to the development in electronic manufacturing technology, packaging and assembly becomes more and more compromised. The concept of the exhibition is to create an entirely new platform for the industry to meet the trends of integrating packaging, assembly and SMT equipment. At the exhibition, you will not only meet your customers to settle your business, but also receive the most up-to-date information from your suppliers, your competitors and your clients about “what’s next” in packaging and assembly manufacturing.
This strong concept as well as the international standard of the event implemented by the organizer, will provide strong support for international exhibitors: