Committee Members

Chairman

Professor Mathias Nowottnick

University Rostock
Chair for Reliability and Safety of Electronic Systems

Vice Chairmen

Professor Thomas Gessner

Chemnitz University
Director of the Centre for Microtechnologies

Fraunhofer Institute for Reliability and Microintegration
Head of the Department „Micro Devices and Equipment“

Fudan University (Shanghai) and Chongqing University
Advising Professor

Professor Bernd Michel

University of Berlin
Head of the Research Group Thermomechanical Simulation and Testing

Fraunhofer Institute for Reliability and Microintegration
Director of Fraunhofer Micro Material Centre

Rolf Aschenbrenner

Fraunhofer Institute for Reliability and Microintegration
Head of Department “Chip Interconnection Technologies“

IEEE Components, Packaging & Manufacturing Technology Society
Vice President Conferences

Further committee members are:

Prof. Hans-Jürgen Albrecht, Siemens AG
Dr.-Ing. Martin Schneider-Ramelow, Fraunhofer Institute for Reliability and Microintegration
Mr. Anton Z. Miric, W.C. Heraeus GmbH
Mr. Shangguan Dongkai, Flextronics Corporate Technology Group
Mr. Rolf Diehm, SEHO Seitz & Hohnerlein GmbH
Mr. Michael Laentzsch, Balver Zinn
Dr. Hans Walter, Fraunhofer Institute for Reliability and Microintegration
Dr. Jutta Mueller, Fraunhofer Institute for Reliability and Microintegration
Mr. Thomas Raisch, SEHO Seitz & Hohnerlein, Shanghai
Mr. Wang Xingqian, Shanghai Electronic Components Trade Association
Prof. Li Ming, Shanghai Jiaotong University
Mr. Jin Cunzhong, China Electronic Equipment Industry Association
Mr. Bi Ke-Yun, China Semiconductor Industry Association
Mr. Jerry Liang, Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET)
Mr. Jack Ding, Heraeus Materials Technology Shanghai Ltd.

Committee Members

Chairman

Vice Chairmen

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