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Call for Papers

Concept
The China SMT Forum is an integrated information platform with a conference and an exhibition. The conference provides high-class expertise in technologies and applications for utilization in SMT-related enterprises. The exhibition gives an overview of today’s marketplace.

The conference will welcome speakers and delegates from the electronic packaging, assembly, and system integration industry to the most progressive trading platform in China.

Topics
You are kindly invited to submit abstracts of proposed papers to China’s Premier SMT, packaging, and assembly event. Topics of interest include but are not limited to:

  • Lead-free Soldering and RoHS-conform Technologies
  • Semiconductor Packaging and Power Electronics
  • PCB Technologies, Surface Finishes and Quality
  • Reliability and Testing
  • Assembling and Soldering Technologies
  • Electronic Markets and Future Trends

Conference Committee

Committee Chairman:
Prof. Dr. Mathias Nowottnick, University of Rostock

Committee Members:
Prof. Thomas Gessner, Chemnitz University of Technology
Prof. Bernd Michel, Fraunhofer IZM
Prof. Rolf Aschenbrenner, Fraunhofer IZM
Prof. Hans-Jürgen Albrecht, Siemens AG
Dr.-Ing. Martin Schneider-Ramelow, Fraunhofer IZM
Mr. Anton Z. Miric, W.C. Heraeus GmbH
Mr. Shangguan Dongkai, Flextronics Corporate Technology Group
Mr. Rolf Diehm, SEHO Seitz & Hohnerlein GmbH
Dr. Hans Walter, Fraunhofer IZM
Dr. Jutta Mueller, Fraunhofer IZM
Mr. Thomas Raisch, SEHO Seitz & Hohnerlein, Shanghai
Mr. Wang Xingqian, Shanghai Electronic Components Trade Association
Prof. Li Ming, Shanghai Jiaotong University
Mr. Jin Cunzhong, China Electronic Equipment Industry Association
Mr. Bi Ke-Yun, China Semiconductor Industry Association
Mr. Jerry Liang, Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET)
Mr. Jack Ding, Heraeus Materials Technology Shanghai Ltd.

Submission
Please send an abstract of your paper to the program committee, including your title, name, position, and biography to:
papers@chinasmtforum.com

Submission Guidelines

  • Papers and abstracts (approx. 300 words) must be delivered in English. Abstracts are due April 30, 2008. NEW DEADLINE!
  • Papers should be 6-12 pages long (including illustrations).
  • The presentation will be limited to 30 minutes, including questions and answers.
  • Speaker and publication guidelines will be provided upon acceptance and will be available online by June 1, 2008.

Best Paper Awards
During the China SMT Forum, two awards will be conferred in the following categories:

  • Committee Award
  • Audience Award

Important Dates

  • Deadline for submission April 30, 2008 NEW DEADLINE!
  • Notification of paper acceptance June 1, 2008
  • Delivery of manuscripts August 31, 2008
  • Delivery of presentations September 30, 2008
  • Registration deadline October 31, 2008

Proceedings
All accepted presentations will be published in the proceedings.
Papers not complying with the publication guidelines may be rejected.