China SMT Forum 2008

International Conference & Exhibition on
Electronic Packaging and Assembly Technologies

Intex Shanghai
Nov. 04-06, 2008

Market Background and Trends

Rapid developments in industry and consumer demands generate electronic products that are characterised by smaller size, high functionality, and increased reliability. These trends constantly require new components which are produced by new packaging technologies.

With the packaging size getting increasingly smaller, there will be a need for assembly equipment to catch up with more precise and advanced technology in order to meet the new manufacturing standards. The gap between the suppliers of electronic assembly equipment and the semiconductor industry will become smaller and smaller, forced by the increasing exchange
of technological developments in both sectors. For example, new packaging technologies like BGA, CSP, etc. are affecting the development of Surface Mount Devices, which are one of the most important driving forces for innovations in the SMT field.

Environmental protection will also set new trends for the development of the industry.
Especially photovoltaic and LED products will raise the demand for electronic devices and new packaging technologies in China. Furthermore all of these new products will need OEM and ODM to improve their capabilities on a higher
manufacturing level.

In order to meet these industrial trends, BMC will present the China SMT Forum 2008 at the INTEX Shanghai from November 4-6, 2008. At the conference and the associated exhibition for electronic packaging and assembly technology, you will meet your suppliers and clients as well as specialists and key people from science and industry in the field of packaging and assembling.

China SMT Forum 2008
Intex Shanghai
Nov.04 -06, 2008

Organized by:
Business Media China AG
Shanghai Science & Technology Development & Exchange Center

Supported by:
Fraunhofer IZM, Berlin

Supporting Associations:
China Semiconductor Industry Association
China Electronic Production Equipment Industry Association
China Electronic Materials Industry Association
China Communication Industry Association
VDMA Productronics

Venue

The Shanghai International Exhibition Center (Intex Shanghai)

will be the venue of the China SMT Forum 2008, which is located at Hongqiao development zone in Puxi area.

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